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Method and Pattern of Dispensing Thermal Interface Materials

Pattern of dispensing thermal interface materials that forms thinner layers rapidly with reduced force and avoids post modification of the microprocessor chip and/or cooling device Technology Overview: This invention relates to thermal interfaces between microprocessor chips and cooling devices and to a method of forming thinner TIM layers more...

Published: 8/23/2021 | Inventor(s): Drew Davidson, Bahgat Sammakia

Keywords(s): #SUNYresearch, Technologies

Category(s): Technology Classifications > Electronics, Campus > Binghamton University