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Method and Pattern of Dispensing Thermal Interface Materials
Method and Pattern for Dispensing Thermal Interface MaterialsThis invention relates to thermal interfaces between microprocessor chips and cooling devices and to a method of forming thinner TIM layers more rapidly, with reduced squeezing force, and that avoids a requirement for modifying the microprocessor chip and/or cooling device.The amount and ...
Published: 7/22/2016   |   Inventor(s): Drew Davidson, Bahgat Sammakia
Category(s): Electronics
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