Thermal Interposers with Nano Structures

Description:

Thermal Interposers with Nano-Structure Enhancements

 

This invention manages thermal challenges in increasingly high power applications and “hot” chip packages. For microelectronics and laser companies using high power packages, Binghamton University thermal interposer technology provides a means for integrated circuits to dissipate heat and continue to operate reliably at elevated temperatures.

 

Metal nanostructures with very high thermal conductivity are designed to penetrate the surfaces they are brought against, thereby greatly reducing the interfacial resistance. This meshing enables a significant increase in power dissipation. Thermally conductive carbon or metal spheres, rods, spikes, and tubes with fin protrusions are suspended in an electrically insulating adhesive carrier along a compression axis. Fitting the nanostructures between the chip and the heat sink allows the construct to more closely match the Coefficients of Thermal Expansion and also reduce failure from cycling.

 

Accordingly, the present invention provides an innovative improvement in conductive adhesives and anisotropic conductive adhesive interconnection technology by growing or attaching nano-structures to the interconnect particles and the microcircuit connect pads.

 

APPLICATIONS

 

Electronics Thermal Management

 

ADVANTAGES

 

Suitable replacement for a significant percentage of current TIM materials, including bulk Indium with metal nanostructures having fins or spikes in contact with each other, allowing heat to percolate through and out

Enables a significant increase in dissipation associated with increasingly high power electronics

Reduces interfacial resistance by an order of magnitude

Thermal grease can also be filled with interlocking nanostructures.

 

INVENTOR

 

Dr. Baghat Sammakia is Vice President of Research and Distinguished University Professor of Mechanical Engineering at Binghamton University. He is the Founding Director of the Small Scale Systems Integration and Packaging Center (S3IP).

 

Dr. Howard Wang is a former Associate Research Professor of Mechanical Engineering at Binghamton University. His research focused nanotechnology innovations for future energy and electronics solutions.

 

I.P.

 

U.S. Patents 7,645,512, 8,173,260, & 8,518,304

 

CONTACT

 

Scott Moser, Esq.

Technology Licensing Assistant

smoser@binghamton.edu

Phone: (607) 777-2685

 

Patent Information:
Category(s):
Electronics
For Information, Contact:
Scott Hancock
Director, IP Management and Licensing
Binghamton University
(607) 777-5874
shancock@binghamton.edu
Inventors:
Wayne Jones
Bahgat Sammakia
Keywords:
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