Description:
A dipping process that deposits a bi-layer coating consisting of a ceramic film with a compliant self-assembled monolayer binding layer grow ceramic thin films onto silicon substrates
Background:
A dipping process that deposits a bi-layer coating consisting of a ceramic film with a compliant self-assembled monolayer (SAM) binding layer grow ceramic thin films onto silicon substrates has been patented at BU and is available for licensing. The field of the invention is protective packaging.
Technology Overview:
Micro-electromechanical systems (MEMS) such as gears, valves, pumps, mirrors, switches, gyroscopes, accelerometers, and bio-compatible devices, microelectronics, and sensors often operate in harsh, wet, corrosive, or high-friction and -stiction environments, or at elevated temperatures. This BU technology offers a multi-purpose protective coating. The bio-inspired approach exploits the synergies of using a flexible SAM as a template for a hard, rigid ceramic overlay film (examples: Zirconia, Titania, Silica) to protect the underlying electronics and devices from mechanical, thermal, and environmental stresses. The BU stepwise deposition technology results in a ceramic film patterned on top of a 2 nm thick SAM; the bi-layer coating exhibits excellent interfacial adhesion while also being “flexible”.
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Advantages:
This novel coating system will allow for the production of devices with the following features:
- Hydrophobic
- Higher temperature capabilities
- Improved wear resistance
- Extended storage life
Intellectual Property Summary:
Patent rights available for licensing.