New Liquid Cooling System for High Power Electronics Package

 New liquid cooling system for high-power electronics.    

 Technology Overview:  

 A new liquid cooling system which is a combination of embedded channels and cold plates has been designed. This novel cooling system consists of two sections: a top section which is connected to the package, and a bottom section which is connected to the liquid inlet and outlet.  

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 Advantages:  

• This liquid cooling system can remove more heat than other cooling methods, like embedded cooling and cold plates only (heat flux range 0.5 W/cm²-300W/cm²).
• It can be used for a wide range of applications and geometries.
• This novel cooling system can be fabricated with different fabrication methods, materials, and dimensions.
• Different coolant liquids can be used based on the application and the amount cooling required.

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