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This invention integrates a crystalline diamond- or sapphire-backed heat spreader directly onto silicon wafers prior to chip fabrication, paired with a sealed fluid chamber that delivers direct-to-chip liquid cooling without thermal interface materials. The result is a low-resistance, high-efficiency cooling path that improves reliability, reduces energy...

This invention introduces advanced liquid-cooled cold plates with localized micro-channel, pin fin, and lattice structures that deliver targeted hotspot cooling, quasi-uniform temperatures, and reduced pumping power for multi-chip modules and 3D-ICs. Background: High-performance computing systems, AI accelerators, and data centers face thermal management...

This invention introduces a regenerative preheater for phase change cooling that reuses waste heat to preheat refrigerant, reducing subcooling, improving efficiency, and eliminating the need for external heaters. Background: Data centers and high-performance computing systems, especially those powering AI, generate extreme heat that challenges cooling...

This invention introduces a next-generation liquid cooling system that integrates embedded microchannels with cold plates to achieve exceptional heat removal, uniform temperature distribution, and low pressure drop for high-power electronics. Its perpendicular dual-flow design ensures continuous coolant renewal, enabling reliable thermal performance...

This technology solves a major heat problem in modern electronics, where traditional thermal interface materials struggle to move heat away fast enough and carbon-nanotube options are often fragile or hard to manufacture. It uses tiny, well-aligned fibers with protective layers to move heat away quickly while maintaining flexibility, durability, and...

Control systems and prediction methods for it cooling performance in containment systems by effectively controlling airflow Background: Containment is becoming a standard modality in data centers today due to its inherent energy efficiency advantages. Cold aisle containment, hot aisle containment, chimney, enclosed racks and rear door heat exchangers...

This invention provides hybrid pastes that transform into a highly conductive metallic network capable of carrying heat, electricity and mechanical load. By removing the organic phase during heating and sintering the inorganic particles, the paste forms a strong bond that works at very high temperatures where conventional materials fail. Background:...

Pattern of dispensing thermal interface materials that forms thinner layers rapidly with reduced force and avoids post modification of the microprocessor chip and/or cooling device Technology Overview: This invention relates to thermal interfaces between microprocessor chips and cooling devices and to a method of forming thinner TIM layers more...