Nano-pastes for Thermal, Electrical, and Mechanical Bonding

Novel paste materials for thermal, electrical and mechanical bonding of two solid surfaces. 

 Technology Overview:  

The pastes contain organic and inorganic hybrid materials and are easy to apply to substrate for assembly. The pastes can be used as thermal interface materials for high demand thermal management applications such as high power microelectronics chip and light emitting diodes. The assembled products can be used for applications that require stability over a wide range of temperatures. 

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 Advantages:  

• Better performance at comparable cost.
• Long life time.

 Intellectual Property Summary: 

U.S. 10,308,856