As the power density of modern electronic systems increases, effective thermal management has become a critical bottleneck in performance and reliability. Conventional air and liquid cooling systems often fail to dissipate heat efficiently at extreme flux densities, resulting in thermal hotspots, temperature non-uniformity, and excessive pressure drop. These limitations hinder the scalability and sustained performance of data centers, electric vehicles, industrial equipment, and high-energy electronic devices that operate under demanding thermal loads.
The fluid cooling system integrates embedded microchannels in a top section with parallel inlet and outlet conduits, defined by cold plates, in a bottom section. The channels and conduits are arranged perpendicularly, allowing fresh coolant to flow continuously across the heated surface while efficiently removing warmed fluid. This architecture provides superior heat transfer and temperature uniformity while minimizing pressure drop. The system supports both single-phase and two-phase liquid cooling and can be fabricated from copper, aluminum, or ceramics through machining or additive manufacturing. Capable of managing localized heat fluxes up to 1 kW/cm², the technology enables high-performance cooling for next-generation electronics.
• Achieves heat removal capacity up to 1 kW/cm² for high-power devices
• Ensures uniform temperature distribution through customizable channel geometry
• Reduces pressure drop with perpendicular embedded and conduit flow paths
• Supports both single-phase and two-phase liquid cooling for broader applications
• Allows fabrication via machining or additive manufacturing using multiple materials
• Offers scalable, application-specific thermal solutions for varied electronic systems
• United States, 63/040,932, Provisional, filed 6/18/2020, converted 8/23/2021
• United States, 17/351,498, Utility Patent, filed 6/18/2021, issued 1/16/2024 as US 11,876,036, status: Patented
Prototype developed under lab-controlled thermal loads of up to 1 kW/cm², incorporating single-phase coolant flow through embedded microchannel architectures.
This technology is available for licensing.
Suitable for companies developing advanced thermal management solutions for data centers, electric vehicles, industrial power systems, and semiconductor cooling where high-flux, ultra-efficient liquid cooling is essential.
Information available upon request.