Description:
This invention introduces a next-generation liquid cooling system that integrates embedded microchannels with cold plates to achieve exceptional heat removal, uniform temperature distribution, and low pressure drop for high-power electronics. Its perpendicular dual-flow design ensures continuous coolant renewal, enabling reliable thermal performance for data centers, electric vehicles, and advanced industrial systems operating at extreme heat flux densities.
Background:
As the power density of modern electronic systems increases, effective thermal management has become a critical bottleneck in performance and reliability. Conventional air and liquid cooling systems often fail to dissipate heat efficiently at extreme flux densities, resulting in thermal hotspots, temperature non-uniformity, and excessive pressure drop. These limitations hinder the scalability and sustained performance of data centers, electric vehicles, industrial equipment, and high-energy electronic devices that operate under demanding thermal loads.
Technology Overview:
The fluid cooling system integrates embedded microchannels in a top section with parallel inlet and outlet conduits, defined by cold plates, in a bottom section. The channels and conduits are arranged perpendicularly, allowing fresh coolant to flow continuously across the heated surface while efficiently removing warmed fluid. This architecture provides superior heat transfer and temperature uniformity while minimizing pressure drop. The system supports both single-phase and two-phase liquid cooling and can be fabricated from copper, aluminum, or ceramics through machining or additive manufacturing. Capable of managing localized heat fluxes up to 1 kW/cm², the technology enables high-performance cooling for next-generation electronics.
Advantages:
• Achieves heat removal capacity up to 1 kW/cm² for high-power devices
• Ensures uniform temperature distribution through customizable channel geometry
• Reduces pressure drop with perpendicular embedded and conduit flow paths
• Supports both single-phase and two-phase liquid cooling for broader applications
• Allows fabrication via machining or additive manufacturing using multiple materials
• Offers scalable, application-specific thermal solutions for varied electronic systems
Applications:
• Data center and high-performance computing (HPC) thermal management
• Power electronics cooling for electric vehicles and renewable energy systems
• Thermal regulation for industrial and defense high-energy systems
• Advanced microelectronics and semiconductor device cooling
• Custom liquid cooling module manufacturing and integration services
Intellectual Property Summary:
• United States, 63/040,932, Provisional, filed 6/18/2020, converted 8/23/2021
• United States, 17/351,498, Utility Patent, filed 6/18/2021, issued 1/16/2024 as US 11,876,036, status: Patented
Stage of Development:
Prototype developed under lab-controlled thermal loads of up to 1 kW/cm², incorporating single-phase coolant flow through embedded microchannel architectures.
Licensing Status:
This technology is available for licensing.
Licensing Potential:
Suitable for companies developing advanced thermal management solutions for data centers, electric vehicles, industrial power systems, and semiconductor cooling where high-flux, ultra-efficient liquid cooling is essential.
Additional Information:
Information available upon request.
Inventors:
Bahgat Sammakia