Description:
This invention provides hybrid pastes that transform into a highly conductive metallic network capable of carrying heat, electricity and mechanical load. By removing the organic phase during heating and sintering the inorganic particles, the paste forms a strong bond that works at very high temperatures where conventional materials fail.
Background:
High power electronic devices generate increasing thermal loads and must operate at temperatures well above the limits of conventional thermal interface materials. Existing greases, gels, adhesives and solders suffer from low thermal conductivity, poor high temperature stability and limited mechanical reliability. Advanced fillers like carbon nanotubes and graphene have not solved these issues due to high interfacial resistance and structural defects. A reliable material is needed that can provide strong thermal, electrical and mechanical bonding across a wide temperature range.
Technology Overview:
The invention uses a hybrid paste of inorganic particles such as silver, copper and carbon in an organic vehicle containing dispersants and process aids. Particle sizes span from nanometers to tens of microns with bimodal or multimodal distributions to optimize packing. During processing the organic vehicle is largely removed by heating and the inorganic particles sinter to form a continuous network. The resulting bond is predominantly inorganic, has high thermal conductivity, low electrical resistivity and strong mechanical integrity across broad temperature cycles.
Advantages:
• High thermal conductivity through a sintered metallic network
• Low electrical resistivity for reliable electrical bonding
• Mechanical robustness at high temperatures
• Bimodal and multimodal particle distributions improve packing and sintering
• Organic vehicle removal reduces interfacial resistance
• Suitable for harsh environments and high power electronics
Applications:
• Thermal management for power electronics and LEDs
• Die attach and interconnects for advanced semiconductor packaging
• High temperature and harsh environment electronic assemblies
• Bonding for energy systems including thermoelectrics and battery modules
• Printed thermal and electrical vias for 3D integrated circuits
Intellectual Property Summary:
• United States 10,308,856
Stage of Development:
Prototype
Licensing Status:
This technology is available for licensing.
Licensing Potential:
Strong potential for semiconductor manufacturers, power electronics companies, and advanced materials developers seeking durable, high-conductivity bonding solutions for high-temperature and high-power applications.
Additional Information:
Information available upon request.
Inventors:
Bahgat Sammakia, Hao Wang
Alternate NCS Title: High Conductivity Sintering Pastes for Durable Thermal and Electrical Bonding