High power electronic devices generate increasing thermal loads and must operate at temperatures well above the limits of conventional thermal interface materials. Existing greases, gels, adhesives and solders suffer from low thermal conductivity, poor high temperature stability and limited mechanical reliability. Advanced fillers like carbon nanotubes and graphene have not solved these issues due to high interfacial resistance and structural defects. A reliable material is needed that can provide strong thermal, electrical and mechanical bonding across a wide temperature range.
The invention uses a hybrid paste of inorganic particles such as silver, copper and carbon in an organic vehicle containing dispersants and process aids. Particle sizes span from nanometers to tens of microns with bimodal or multimodal distributions to optimize packing. During processing the organic vehicle is largely removed by heating and the inorganic particles sinter to form a continuous network. The resulting bond is predominantly inorganic, has high thermal conductivity, low electrical resistivity and strong mechanical integrity across broad temperature cycles.
• High thermal conductivity through a sintered metallic network
• Low electrical resistivity for reliable electrical bonding
• Mechanical robustness at high temperatures
• Bimodal and multimodal particle distributions improve packing and sintering
• Organic vehicle removal reduces interfacial resistance
• Suitable for harsh environments and high power electronics
• United States 10,308,856
Prototype
This technology is available for licensing.
Strong potential for semiconductor manufacturers, power electronics companies, and advanced materials developers seeking durable, high-conductivity bonding solutions for high-temperature and high-power applications.
Information available upon request.